Electronic component and method of manufacture
US6056888A · kind A · utility
13Cited by
8References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 19, 1999 |
| Grant date | May 2, 2000 |
| Priority date | — |
| Expiry date | Apr 19, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0054
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electronic component includes a substrate (201) with a surface (202), a resistor structure (210) supported by the substrate, and a passivation layer (300, 805) over the resistor and the surface of the substrate where the passivation layer has a hole (311, 312, 611, 612, 613, 614, 711, 811), where the surface of the substrate has a compressive portion and a tensile portion, and where the resistor is located between the compressive and tensile portions of the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.