Epoxy/thermoplastic photocurable adhesive composition
US6057382A · kind A · utility
47Cited by
52References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 1998 |
| Grant date | May 2, 2000 |
| Priority date | — |
| Expiry date | May 1, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31587
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A curable composition comprising a) a curable epoxy resin, a thermoplastic ethylene-vinyl acetate copolymer resin, and an effective amount of a photocatalyst for the curable epoxy resin, wherein the composition is free from hydrocarbon polyolefins and wherein the sum of a) and b) is 100 weight percent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.