Patent · US Expired

Integrated semiconductor circuit housing

US6057595A · kind A · utility

10Cited by

4References

5Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Jens Pohl · San Luis Obispo, US
Bruno Golz · Jesenwang, DE
Harald Widner · Ingolstadt, DE

Key dates

Filing date	Dec 28, 1998
Grant date	May 2, 2000
Priority date	—
Expiry date	Dec 28, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The integrated semiconductor circuit has a semiconductor chip, a housing that accommodates the semiconductor chip, and a lead frame that connects the contact areas of the semiconductor chip and forms external terminals of the integrated semiconductor circuit. The conductors of the lead frame are sunk, in the regions of the housing in which the distance between the edge of the housing and the semiconductor chip is relatively large, to the central plane of the housing, with the result that the conductors of the lead frame have depressions in those regions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.