Molded housing with integral heatsink
US6058013A · kind A · utility
43Cited by
6References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1998 |
| Grant date | May 2, 2000 |
| Priority date | — |
| Expiry date | Jul 2, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10969
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A plastic housing assembly is constructed with a non-plateable plastic wall portion (101), and a plateable plastic wall portion (107) positioned abutting (109) the non-plateable plastic wall portion (101). The plateable plastic wall portion (107) has a via (115) disposed therethrough for thermally coupling an outer surface (111) to an inner surface (113). A heat-generating component (119) is disposed coupled to the second inner surface (113). The via (115) is preferably plated with metal so that heat produced from the heat-generating component (119) is conducted away from the inner surface (113) to the outer surface (111).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.