Method for cleaning a semiconductor wafer
US6059893A · kind A · utility
24Cited by
12References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 27, 1998 |
| Grant date | May 9, 2000 |
| Priority date | — |
| Expiry date | Jul 27, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A semiconductor cleaning method for removing particles that have adhered to the back side of a semiconductor wafer. The semiconductor wafer is placed on a support. Inert gas is blown against the back of the semiconductor wafer by a plurality of nozzles, each of which is positioned at a predetermined angle to the back of the semiconductor wafer and inclined in a first direction. An air exhaust is located near the periphery of the semiconductor wafer and arranged so as to suck in the particles removed from the semiconductor wafer with the nozzles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.