Curable polyolefin compositions containing organosilicon compounds as adhesion additives
US6060559A · kind A · utility
42Cited by
24References
24Claims
0Family size
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Key dates
| Filing date | Sep 4, 1998 |
| Grant date | May 9, 2000 |
| Priority date | — |
| Expiry date | Sep 4, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The presence in curable polyolefin compositions of a moisture curable organosilicon compound containing at least one alkenyloxy group bonded to the silicon atoms improves the adhesion to a variety of substrates that is developed during the curing reaction of polyolefin compositions cured by a hydrosilation reaction. The organosilicon compound is preferably a reaction product of ingredients comprising 1) a silane or bis-silylalkane containing at least three silicon-bonded moisture-reactive groups per molecule and 2) an organic compound containing at least one carbinol group and at least one ethylenically unsaturated group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.