Epoxy resin composition
US6060611A · kind A · utility
6Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1998 |
| Grant date | May 9, 2000 |
| Priority date | — |
| Expiry date | Dec 30, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/3218
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
To provide an epoxy resin composition which can provide a cured resin which is excellent in weatherability and electric properties, and which is useful as a resin for coatings, an encapsulant, a casting material, an electric insulator, etc. An epoxy resin composition which contains a hydrogenated epoxy resin obtained by hydrogenation of an aromatic epoxy resin, wherein the hydrogenated epoxy resin has a hydrogenation ratio in an aromatic ring of not less than 85%, a loss ratio of epoxy groups of not more than 20%, and a total chlorine content of not more than 0.3% by weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.