Electrolytic layer applied to metallic foil to promote adhesion to a polymeric substrate
US6060666A · kind A · utility
2Cited by
7References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 22, 1997 |
| Grant date | May 9, 2000 |
| Priority date | — |
| Expiry date | Dec 22, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12931
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A metallic foil, and a process for producing the same, having a metallic micro-layer electrodeposited on a surface of the foil, wherein the micro-layer comprises two co-deposited metals each being a metal other than the metal forming the foil, and does not change the topography of the surface on which it is deposited. The foil may be formed of copper, and the micro-layer may be formed of iron and nickel. When bonded to a polymeric substrate the peel strength of the foil is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.