Selective laser removal of dielectric coating
US6060683A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 22, 1998 |
| Grant date | May 9, 2000 |
| Priority date | — |
| Expiry date | Sep 22, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process for selectively removing a dielectric layer from a portion of a panel to create a coated and an uncoated region, the process including (a) applying a laser-termination bead on the panel to separate a first region corresponding to the coated region from a second region corresponding to the uncoated region; (b) applying a dielectric coating over the panel and the laser-termination bead; (c) cutting the dielectric layer along the laser-termination bead with a laser beam; and (d) peeling away the dielectric layer from the second region. The panel may be a direct radiography panel; the dielectric layer may be a polymer such as parylene; the laser-termination bead may be an epoxy; and/or the laser may be an excimer laser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.