Semiconductor device, method of manufacturing the semiconductor device, and method of manufacturing lead frame
US6060768A · kind A · utility
158Cited by
14References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 1997 |
| Grant date | May 9, 2000 |
| Priority date | — |
| Expiry date | Sep 23, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1576
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor chip in which electrode pads are formed with a first pitch, leads electrically connected with the electrode pads through lines, and sealing plastic sealing the semiconductor chip. In the semiconductor device, projections used for external connection ports are formed in the leads with a second pitch. The sealing plastic seals the lines connecting the electrode pads and the leads, but the projections are exposed from the sealing plastic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.