Semiconductor chip and method of manufacturing the same
US6060773A · kind A · utility
3Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 1998 |
| Grant date | May 9, 2000 |
| Priority date | — |
| Expiry date | May 7, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/922
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip has a nonvolatile memory formed on the upper surface side of a semiconductor substrate. The chip includes at least one recess portion formed in the lower surface of the semiconductor substrate. The recess portion is located in a region corresponding to the nonvolatile memory. A method of manufacturing the semiconductor chip is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.