Semiconductor device
US6060774A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 31, 1997 |
| Grant date | May 9, 2000 |
| Priority date | — |
| Expiry date | Oct 31, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A copper sheet having an aperture provided therein at a bonding area for clearing the semiconductor chip and its bonding wires is bonded by an adhesive to a sealing side of an organic substrate which has been loaded on the sealing side with a pattern of copper foil wiring. The copper sheet is higher in adhesiveness to a sealing resin than to any conventional resist. A resultant semiconductor device according to the present invention will prevent detachment of the sealing resin at an interface, which may result from a thermal history in the sealing or reflow process and eliminate entrance of water, hence minimizing a decline in resistance to moisture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.