Method and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference management
US6061235A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1998 |
| Grant date | May 9, 2000 |
| Priority date | — |
| Expiry date | Nov 18, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A modular integrated apparatus and method that integrates mechanical, electrical, and thermal management, and that includes a computer processor (CPU), or VLSI module, connected to a circuit board and a thermal plate. The modular integrated apparatus includes a field replaceable apparatus and a receiving apparatus and attenuates EMI. By integrating mechanical, electrical, and thermal management features the modular integrated apparatus improves the process of repairing and upgrading the processor at a customer site by simplifying the modular integrated apparatus package. Additionally, by reducing the number of parts and the amount of circuit board space required to connect a processor to a thermal plate, the present embodiment improves ease of use and acts as a handle in its own installation and removal. Further, by including the processor and a heat sink in the field replaceable apparatus, the field replaceable apparatus reduces handling in the field and the risk of damage to the processor, and may be tested prior to installation in the field to ensure it operates properly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.