Semiconductor chip-mounting board providing a high bonding strength with a semiconductor chip mounted thereon
US6061248A · kind A · utility
21Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 1997 |
| Grant date | May 9, 2000 |
| Priority date | — |
| Expiry date | Jul 18, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A strengthening land is formed on a semiconductor chip-mounting board corresponding to a non-operating electrode on a semiconductor chip. The strengthening land and the non-operating electrode are bonded with each other, thereby to improving a bonding strength between the semiconductor chip and the semiconductor chip-mounting board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.