Sealing system and method for sealing circuit card connection sites
US6061249A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 12, 1997 |
| Grant date | May 9, 2000 |
| Priority date | — |
| Expiry date | Nov 12, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1147
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one form, the invention is directed to the combination of: a plate; a first connector on the plate; a first circuit card assembly including a first circuit card and a second connector on the first circuit card which second connector is capable of coupling to the first connector; and a layer of sealing material on the plate and having a first opening therein to accept a part of the first circuit card assembly with the first and second connectors coupled. The layer of sealing material has a first cantilevered flap which has a first, relaxed state. The first cantilevered flap is deflected from the first state into a second state wherein the first cantilevered flap bears sealingly against a part of the first circuit card assembly with the first and second connectors coupled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.