Device and method for removing heatspreader from an integrated circuit package
US6061889A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 1998 |
| Grant date | May 16, 2000 |
| Priority date | — |
| Expiry date | Jun 19, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53896
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device for removing a heatspreader from an integrated circuit package (ICP) according to the present invention. The device includes a base piece that is preferably made of a suitably rigid and thermally conductive base material such as tool steel. The base piece defines a base cavity that is adapted to receive and engage the heatspreader. The depth of the base cavity is approximately equal to a thickness of the heatspreader. The device further includes a top piece comprised of a suitable top material such as tool steel. The top piece includes a body portion from which an elongated member or handle extends. The body portion of the top piece defines a top cavity adapted to receive and engage the integrated circuit package. The elongated member is suitable for manipulating the body portion of the top piece to apply a torquing force to the ICP package when it is engaged in the top cavity. The base cavity of the base piece and the top cavity of the top piece are adapted to form an enclosure suitable for retaining the ICP and the heatspreader when the base piece is suitably aligned and in contact with the top piece. In this configuration, with the heatspreader being engaged by the base…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.