Patent · US Expired

Planar trenches

US6063693A · kind A · utility

2Cited by
4References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 23, 1998
Grant dateMay 16, 2000
Priority date
Expiry dateMar 23, 2018

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/763
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Method for improving the topography over trench structures in which the provision of extra poly-semiconductor material e.g. polysilicon or nitrate or oxide in the regions of the trench edges and, if necessary, the subsequent oxidation of the extra material prevents the occurrence of regions of high mechanical stress.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.