Planar trenches
US6063693A · kind A · utility
2Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 1998 |
| Grant date | May 16, 2000 |
| Priority date | — |
| Expiry date | Mar 23, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/763
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method for improving the topography over trench structures in which the provision of extra poly-semiconductor material e.g. polysilicon or nitrate or oxide in the regions of the trench edges and, if necessary, the subsequent oxidation of the extra material prevents the occurrence of regions of high mechanical stress.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.