Perimeter trace probe for plastic ball grid arrays
US6064214A · kind A · utility
11Cited by
8References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 19, 1997 |
| Grant date | May 16, 2000 |
| Priority date | — |
| Expiry date | Dec 19, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07314
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test probe assembly for testing integrated circuit (IC) packages mounted onto a ball grid array is described. The test probe assembly can also be used to interconnect test instrumentation to the ball grid array without removal from the circuit in which it is mounted and with a minimal impact on the performance of the circuit. Contacts on the test probe assembly make electrical contact to test traces fabricated on the top side of the ball grid array package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.