Millimeter wave module with an interconnect from an interior cavity
US6064286A · kind A · utility
61Cited by
22References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 1998 |
| Grant date | May 16, 2000 |
| Priority date | — |
| Expiry date | Jul 31, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged integrated circuit (20, 20a, 20b) which includes at least one waveguide port (44, 44a, 44b) and at least one interconnect (26, 26a, 26b) which is electrically connected to an integrated circuit (30, 30a, 30b).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.