Thermal head and its fabrication method
US6064415A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 1998 |
| Grant date | May 16, 2000 |
| Priority date | — |
| Expiry date | May 29, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09845
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal head comprises an insulative substrate, heat-generating resistor elements mounted on the insulative substrate, a driver IC mounted on the insulative substrate for driving the heat-generating resistor elements, a heat radiating member connected to the insulative substrate for radiating heat generated by the heat-generating resistor elements, and a flexible circuit board for supplying power to the driver IC. The flexible circuit board has conductor layers interposed between insulating layers, a first portion connected to the heat radiating member, and a second bent portion having one of the conductor layers electrically connected to the insulative substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.