Pattern inspection method and system
US6064484A · kind A · utility
23Cited by
3References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 11, 1997 |
| Grant date | May 16, 2000 |
| Priority date | — |
| Expiry date | Mar 11, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pattern inspection method includes the steps of: obtaining first image data by optically picking up an actually formed pattern such as a reticle; aligning a position of the first image data with second image data of a pattern at a different layer from that of the first image data; and performing a first pattern inspection using the first and second image data. Defect inspection can be executed in a short time with a practically sufficient precision.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.