Method for cooling electronic devices using a flexible coolant conduit with slip on cold plates
US6065208A · kind A · utility
17Cited by
10References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 1999 |
| Grant date | May 23, 2000 |
| Priority date | — |
| Expiry date | Jan 19, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To achieve the above-mentioned objects, and other related ones a method and apparatus for cooling of an electronic assembly is suggested. The electronic assembly is placed in thermal contact with a monolithic, non-jointed flexible coolant conduit housing a coolant. A plurality of cold plates are then slipped over the conduit, through their indentation like opening along a peripheral edge of each plate. The conduit with plates is then bend so as to complement the contour of the assembly to be cooled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.