Electroless deposition of metal films with spray processor
US6065424A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Dec 18, 1996 |
| Grant date | May 23, 2000 |
| Priority date | — |
| Expiry date | Dec 18, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1692
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Electroless plating of very thin metal films, such as copper, is accomplished with a spray processor. Atomized droplets or a continuous stream of an electroless plating solution are sprayed on a substrate. The electroless plating solution may be prepared by mixing a reducing solution and a metal stock solution immediately prior to the spraying. The deposition process may be carried out in an apparatus which includes metal stock solution and reducing reservoirs, a mixing chamber for forming the plating solution, optionally an inert gas or air (oxygen) source, a process chamber in which the solution is sprayed on the substrate and a control system for providing solutions to the mixing chamber and the process chamber in accordance with a predetermined program for automated mixing and spraying of the plating solution. The process can be used to form metal films as thin as 100 .ANG. and these films have low resistivity values approaching bulk values, low surface roughness, excellent electrical and thickness uniformity and mirror-like surface. Low temperature annealing may be used to further improve electrical characteristics of the deposited films. The thin metal films produced by the d…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.