Method of installing heat pipes using internal vapor pressure
US6065664A · kind A · utility
3Cited by
7References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 1998 |
| Grant date | May 23, 2000 |
| Priority date | — |
| Expiry date | Aug 10, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49865
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The disclosure is for a method of installing a heat pipe within another structure. A completely processed heat pipe is coated with solder and inserted into a cylindrical hole within the structure with sliding clearance. The casing of the heat pipe is then expanded into tight contact with the surrounding hole by heating the heat pipe and expanding the heat pipe casing with the heat pipe's own internal vapor pressure. The application of heat also simultaneously melts the solder to bond the heat pipe into the hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.