Hard carbon thin film and method of forming the same
US6066399A · kind A · utility
36Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 1998 |
| Grant date | May 23, 2000 |
| Priority date | — |
| Expiry date | Mar 19, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A hard carbon thin film formed on a substrate has a graded structure in which a ratio of sp.sup.2 to sp.sup.3 carbon-carbon bonding in the thin film decreases in its thickness direction from a thin film/substrate interface toward a surface of the thin film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.