Method for fabricating a shielded multilevel integrated circuit capacitor
US6066537A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 2, 1998 |
| Grant date | May 23, 2000 |
| Priority date | — |
| Expiry date | Feb 2, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multilevel capacitor structure compatible with CMOS processing for use in switched capacitor circuits is disclosed. The capacitor structure has an associated parasitic capacitor which is placed in such a way so as to minimize the impact on the performance of a the switched capacitor circuit. The parasitic capacitor is formed between a first plate of the shielded capacitor and a diffusion well within a substrate. The diffusion well is connected to a quiet voltage reference source to isolate the shielded capacitor from noise present on the substrate. The shielded capacitor has a first plate that is fabricated from a first conductive material such as polycrystalline silicon or polycide, a second plate fabricated from a second conductive material such as a first level of metal on an integrated circuit, and a third capacitor plate fabricated from a second level of metal of an integrated circuit. The first plate and the third plate are connected to give a total capacitance given by the sum of capacitances between the first plate and second plate and between the second plate and third plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.