Method for manufacturing a capacitor of a semiconductor device
US6066540A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 1998 |
| Grant date | May 23, 2000 |
| Priority date | — |
| Expiry date | Aug 28, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/682
Abstract
A method for manufacturing a capacitor of semiconductor device is provided, which method has the steps of providing a semiconductor substrate; forming a intermediate insulating film having a contact plug on the semiconductor substrate; forming a tungsten nitride film as an diffusion barrier film on the intermediate insulating film including the contact plug; and forming a stack structure of a lower electrode, a dielectric layer and an upper electrode on the tungsten nitride film. So, the destruction of diffusion protection film due to the tension stress can be protected and the reaction of silicide between the electrode material and the contact plug which is a polysilicon can be controlled since the tungsten nitride film has an excellent diffusion protection property so that the property deterioration of the device can be protected, the characteristic and reliability of semiconductor device can be improved and then large scale integration of semiconductor device can be embodied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.