Applying encapsulating material to substrates
US6067709A · kind A · utility
12Cited by
17References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1996 |
| Grant date | May 30, 2000 |
| Priority date | — |
| Expiry date | Feb 23, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Providing encapsulated electronic components on a circuit board by providing dams on a circuit board around areas on which respective electronic components will be mounted, mounting the respective electronic components within the dams on the circuit board, and printing encapsulating material through a stencil in order to provide deposits of encapsulating material over the electronic components and within the dams.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.