Patent · US Expired

Smart card with card body and semiconductor chip on a leadframe

US6068191A · kind A · utility

11Cited by

1References

6Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Dieter Dlugosch · Heilsbronn, DE
Roland Prass · Ottensoos, DE
Josef Kirschbauer · Blaibach, DE
Gunter Didschies · Nürnberg, DE

Key dates

Filing date	Feb 1, 1999
Grant date	May 30, 2000
Priority date	—
Expiry date	Feb 1, 2019

Classification

Technology area (CPC G)Physics
CPC primaryG06K19/07743
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

The smart card has a semiconductor chip combined with a leadframe. The smart card is rendered operationally and functionally reliable with regard to bending and tensile stresses, in that the connecting tabs which form the electrical contacts of the leadframe are extended to the outside and embedded in the plastic card body. Beads are incorporated for the additional relief of mechanical stresses.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.