Phenol resin molding compound
US6069198A · kind A · utility
1Cited by
5References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 4, 1999 |
| Grant date | May 30, 2000 |
| Priority date | — |
| Expiry date | Aug 4, 2019 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16C33/201
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a molding compound comprising a phenol resin, a curing agent for the resin, a chopped strands of glass fiber, and a graphite. The material is molded into slide members which exhibit good abrasion resistance when used under water-lubricated conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.