Insulating material and windings thereby
US6069430A · kind A · utility
22Cited by
11References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1999 |
| Grant date | May 30, 2000 |
| Priority date | — |
| Expiry date | Feb 25, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49009
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The high thermoconductive insulating film 11 was formed around the outer periphery of the wound conductors 10, using the high thermoconductive insulating tape 1 comprising the mica layer 3, the reinforcement layer 5, and the high thermoconductive filler layer 7, wherein the resin content in each layer of the mica layer 3 and the high thermoconductive filler layer 7 is specified to the range of 10-25% by weight of the total weight of the material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.