Method of manufacturing chip components
US6070787A · kind A · utility
3Cited by
5References
16Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 29, 1997 |
| Grant date | Jun 6, 2000 |
| Priority date | — |
| Expiry date | Oct 29, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/06
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A chip component is manufactured through a step of burning a unburned unit element made of ceramics having prism-shaped parts at its ends, a step of polishing the edges of the burned unit element, and a step of forming a resistor conductor, an electrode conductor and a armor on the polished unit element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.