Thermally buckling linear micro structure
US6070851A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1998 |
| Grant date | Jun 6, 2000 |
| Priority date | — |
| Expiry date | Jun 8, 2018 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16K2099/008
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A thermally buckling linear micro structure, in which by isolating technology a thermal oxidization isolation layer are generated on the two ends of a micro structure, or a material with larger thermal inflation coefficient is deposited, or the area of thermal conduction is reduced so that the two ends of a micro structure has a larger thermal stress and the membrane structure may be heated uniformly so to cause a thermally buckling deformation, therefore, the deformation of the membrane type micro structure is amplified linearly with the input power. This micro structure is formed as a membrane type by a membrane manufacturing technology.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.