Method for making a printhead
US6071427A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 3, 1998 |
| Grant date | Jun 6, 2000 |
| Priority date | — |
| Expiry date | Jun 3, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1643
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The invention described in the specification relates to an improved method for making a printhead for an ink jet printer. In the method, one or more semiconductor substrates containing energy imparting devices for ink and electrical conductors for the energy imparting devices are attached to a metal substrate carrier. A conductive layer containing electrical tracing terminating in contact pads is also attached to the carrier using an adhesive. A nozzle plate is attached to the conductive layer and to the semiconductor substrate also using an adhesive. The nozzle plate, conductive layer and adhesive all have openings or windows therein for use in forming wire bonds between the semiconductor substrate and the conductive layer. Once the wire bonds having loops are formed, the wire loops are depressed toward the nozzle plate to reduce the height of the loops above the nozzle plate. The entire wires and bonds are then encapsulated in a elastomeric, insulative material to protect the wires. An advantage of the depressed wire loops is that the encapsulating material layer may be relatively thin so that it does not extend above the exposed surface of the nozzle plate more than about 15 mil…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.