Flexible circuits and carriers and process for manufacture
US6071597A · kind A · utility
74Cited by
28References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 1997 |
| Grant date | Jun 6, 2000 |
| Priority date | — |
| Expiry date | Aug 28, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible circuit carrier including at least one layer of polymer dielectric material, at least one layer of conductive material thereover, each layer having two major surfaces, at least one of said layers having at least one aperture therein, wherein at least one layer has a material coated on at least a portion thereof having a Young's Modulus of from about 100 to about 200 GPa, a dielectric constant (between 45 MHz and 20 GHz) of from about 8 to about 12, and a Vickers hardness of from about 2000 to about 9000 kg/mm.sup.2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.