Flexible skin incorporating mems technology
US6071819A · kind A · utility
42Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 1998 |
| Grant date | Jun 6, 2000 |
| Priority date | — |
| Expiry date | Jan 23, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/24137
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A flexible skin formed of silicon islands encapsulated in a polyimide film. The silicon islands preferably include a MEMS device and are connected together by a polyimide film (preferably about 1-100 .mu.m thick). To create the silicon islands, silicon wafers are etched to a desirable thickness (preferably about 10-500 .mu.m) by Si wet etching and then patterned from the back side by reactive ion etching (RIE).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.