Printed wiring board with grounding lines arranged between wiring lines
US6072126A · kind A · utility
12Cited by
9References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 1997 |
| Grant date | Jun 6, 2000 |
| Priority date | — |
| Expiry date | May 1, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board comprises: a plurality of solder lands, a wiring pattern having a plurality of wiring lines connected to the solder lands, respectively, an output terminal formed at one end of each of the wiring lines of the wiring pattern, an integrated control circuit connected to the solder lands, and a grounding pattern to be held at a ground potential. The grounding pattern has grounding lines formed between the adjacent wiring lines of the wiring pattern, respectively, so as to be coupled to the wiring lines by capacitive coupling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.