Modular heat sink stack
US6072697A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 15, 1998 |
| Grant date | Jun 6, 2000 |
| Priority date | — |
| Expiry date | Jul 15, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Heat sink apparatus (100) for use in an enclosure (12) in which electrical component; installed on circuits boards (42, 44, 48, 50) are mounted in the enclosure in a stacked arrangement (30) with the components in proximity to each other. Heat conductive plates (102) are also formed in a stacked arrangement and are inserted between adjacent circuit boards in an interdigitated manner for heat generated by the components to be conducted away from the components by the plates. A plurality of pouches (106, 116) containing a liquid heat sink material or surface comformable, conductive elastomer pads are inserted between each side of each heat conductive plates and the printed circuit boards, and between sidewalls (51, 52, 18) of the enclosure and the stack of heat conductive plates. The heat sink apparatus (100) increases the efficiency of heat transfer away from the components so to prevent the components from overheating by providing a heat conduction, transfer path from the components (118) to the enclosure (12).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.