Patent · US Expired

Chip module with heat insulation for incorporation into a chip card

US6072698A · kind A · utility

9Cited by

7References

4Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Detelf Houdeau · Regensburg, DE
Josef Kirschbauer · Blaibach, DE
Hans-Georg Mensch · Neunburg vorm Wald, DE
Peter Stampka · Burglengenfeld, DE
Hans-Hinnerk Steckhan · Munich, DE

Key dates

Filing date	Mar 27, 1998
Grant date	Jun 6, 2000
Priority date	—
Expiry date	Mar 27, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/14
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A heat flow which is introduced into a chip module from the outside is specifically controlled to avoid delaminations between a covering composition and a chip during a hot-melt incorporation process. This takes place either by a heat-insulating layer which is interposed between a flexible carrier tape of the chip module and a chip adhesively fixed thereon, or by clearances within an area or layer of metal contacts. As a result, a heat flow from a hollow punch brought down in an outer region of the metal contacts, in the direction of the centrally mounted chip, is prevented.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.