Microlaser submount assembly and associates packaging method
US6072815A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 27, 1998 |
| Grant date | Jun 6, 2000 |
| Priority date | — |
| Expiry date | Feb 27, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02438
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The submount assembly includes a heat sink and a submount mounted upon the heat sink that is formed of a thermally conductive, electrically insulating material so as to transfer heat from the various components mounted upon the submount to the heat sink while effectively electrically isolating the various components mounted upon the submount. The first surface of the submount defines at least one registration feature, such as at least one recess, for precisely aligning components mounted thereupon. For example, the submount assembly can include a microresonator cavity including an active gain medium disposed within a respective recess defined by the submount. The submount assembly can also include a laser diode mounted upon the submount in alignment with the active gain medium such that the output of the laser diode pumps the active gain medium. The submount assembly also generally includes first and second metallization layers disposed upon different portions of the submount to thereby form a cathode and an anode, respectively. The present invention also provides a method for packaging the submount assembly which reduces the risk of damage to the components mounted upon the submou…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.