Separation of semiconductor material

US6073773A · kind A · utility

Assignee

• Wacker Chemie AG · DE

Inventors

• Reinhard Wolf · Isny im Allgäu, DE
• Dirk Flottmann · Altötting, DE

Key dates

• Filing date: Oct 1, 1999
• Grant date: Jun 13, 2000
• Expiry date: Oct 1, 2019

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B07B1/4609
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

A method and a device for the separation of semiconductor material has the separation procedure carried out on screens coated with ice made of ultrapure water, optionally mixed with particles of semiconductor material. During the separation, the screens are sprayed with ultrapure water and the screen holes are cut free.