Patent · US Expired

Package, package manufacturing method and package manufacturing system for carrying out the package manufacturing method

US6074097A · kind A · utility

52Cited by
5References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 23, 1998
Grant dateJun 13, 2000
Priority date
Expiry dateApr 23, 2018

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB31B70/64
  • WIPO fieldHandling
  • WIPO sectorMechanical engineering

Abstract

A pair of superposed laminated films are fed by a web feed unit, and a longitudinal heat-sealing unit and a lateral heat-sealing unit unite together the pair of films by heat-sealing. A notch and tearing incision forming unit forms notches and tearing incisions in the pair of films. A cutting unit cuts the thus processed pair of united films into packages.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.