Polypropylene resin composition and method for coating molded products of the resin composition
US6075086A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 1993 |
| Grant date | Jun 13, 2000 |
| Priority date | — |
| Expiry date | Jun 25, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Herein provided are a polypropylene resin composition which comprises (A) a polypropylene, (B) an ethylene-propylene-diene terpolymeric rubber having a Mooney viscosity, ML.sub.1+4 (100.degree. C.), ranging from 5 to 50 and an iodine value of not less than 15, the content of the component (B) ranging from 10 to 50% by weight on the basis of the total weight of the components (A) and (B), and optionally (C) an inorganic filler in an amount ranging from 0 to 40 parts by weight per 100 parts by weight of the sum of the components (A) and (B); a coating method which comprises the steps of applying a primer coating to a molded product obtained by molding the foregoing polypropylene resin composition or irradiating the molded product with plasma without degreasing and washing the product with a halogen atom-containing organic solvent and then applying a top coat to the product; and a coating method which comprises the steps of degreasing and washing a molded product obtained by molding the foregoing polypropylene resin composition and then applying a top coat to the product without applying a primer coating to the molded product or irradiating the molded product with plasma. The coated f…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.