Multi-layered printed wiring board
US6075211A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 1996 |
| Grant date | Jun 13, 2000 |
| Priority date | — |
| Expiry date | Sep 13, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is provided a multi-layered printed wiring board including a power supply layer, a ground layer, a signal layer, and insulators sandwiched between those layers. The power supply layer is provided with a circuit in the form of wirings for imparting impedance thereto. For instance, the power supply layer may be formed to include main wirings for distributing a dc current entirely to the printed wiring board with a dc voltage drop being depressed, and branch wirings for enhancing high frequency impedance to isolate circuits in terms of high frequency, which circuits are mounted on the multi-layered printed wiring board and operated independently with each other. The invention makes it possible to provide a relatively great inductance to thereby decrease high frequency power supply current which is generated on IC/LSI operation and is to flow into decoupling capacitors. In addition, in accordance with the present invention, it is possible to identify a route through which a current runs into the power supply layer to thereby provide an optimal decoupling capacitor to every IC/LSI as a source of high frequency power supply current.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.