Heat transfer device for a retention assembly
US6075702A · kind A · utility
18Cited by
8References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 1999 |
| Grant date | Jun 13, 2000 |
| Priority date | — |
| Expiry date | May 26, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1431
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat transfer device for use with a retention assembly is herein disclosed. The retention assembly is mounted over one or more connectors attached to a circuit board. The retention assembly houses one or more processor modules that mount into the connectors. The processor modules include a heat transfer device. The heat transfer device has a pair of rail guides that cover the outer edges of the processor module. The rail guides enable the processor module to slide in and out of the retention assembly thereby enabling the processor module to be securely mounted into the connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.