Patent · US Expired

Micromechanical microphone

US6075867A · kind A · utility

63Cited by
2References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 19, 1998
Grant dateJun 13, 2000
Priority date
Expiry dateMar 19, 2018

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH04R19/04
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A Micromechanical Microphone is formed with a housing and a transducer therein. The housing has a sound inlet on one side of the transducer and a pressure compensation hole on the opposite side. A sealing diaphragm is placed on each side of the transducer to seal it against humidity, dust and dirt. The transducer may be a capacitive transducer with an external bias or an electret based transducer. The microphone is useful in small devices such as hearing aides.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.