Method of centerless ground finishing of feedthrough pins for an implantable medical device
US6076017A · kind A · utility
89Cited by
22References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 1998 |
| Grant date | Jun 13, 2000 |
| Priority date | — |
| Expiry date | Feb 11, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01M50/247
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A centerless grinding method of finishing feedthrough pins and corresponding devices for use in implantable medical devices and for components such as batteries in implantable medical devices is disclosed. The method provides certain advantages, including the elimination of longitudinal anomalies in drawn wire to thereby improve the hermeticity of implantable medical devices. In one of the preferred methods, the surface of an over-size medical grade wire having a known anomaly depth is centerless ground using an abrasive wheel and suitable coolant to a layer past which those anomalies disappear.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.