Thermally conductive, corrosion resistant printhead structure
US6076912A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 3, 1998 |
| Grant date | Jun 20, 2000 |
| Priority date | — |
| Expiry date | Jun 3, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/03
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The invention described in the specification relates to a carrier for an ink jet printhead having unique characteristics which substantially inhibit corrosion and provide improved thermal heat transfer from energizer devices for the ink to the surrounding atmosphere. The carrier has top and bottom surfaces and is adapted to receive a chip and a circuit layer thereon. Another feature of the carrier is a well having a base and walls surrounding the base for receiving a semiconductor chip therein. The walls extend above the top surface of the carrier to a wall height that is substantially equal to the thickness of the circuit layer. The well has a well depth that is substantially equal to the thickness of the chip. A slot formed in the base of the well extends from the bottom surface of the carrier to the base and provide a flow path for ink to the energizers on the chip. Use of a separate carrier for the printhead components provides increased process versatility during the manufacture of the printhead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.