Polishing pad and apparatus for polishing a semiconductor wafer
US6077153A · kind A · utility
34Cited by
9References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 26, 1997 |
| Grant date | Jun 20, 2000 |
| Priority date | — |
| Expiry date | Nov 26, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/28
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for polishing a semiconductor wafer includes a polishing pad to be in contact with the semiconductor wafer; a turn table which rotates the polishing pad; and an elastic member which is arranged between the turn table and the polishing pad. The polishing pad includes a polishing layer which is made of a material having a good characteristic of slurry holding; and a support layer which is made of a rigid material having an optimum thickness to prevent the polishing layer from loosening. The polishing pad is attached to the turn table by a stretch-holding technique without adhesive bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.