Al-Cu-Mg sheet metals with low levels of residual stress
US6077363A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1996 |
| Grant date | Jun 20, 2000 |
| Priority date | — |
| Expiry date | Jun 17, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12764
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A metal sheet with a total thickness >0.5 mm comprising an AlCuMg aluminum alloy consisting essentially of Al and, in percent by weight: ______________________________________ 3.5 < Cu < 5.0 1.0 < Mg < 2.0 Si < 0.25 Fe < 0.25 Mn < 0.55 ______________________________________ PA0 all other elements: <0.25 PA0 with 0<Mn-2Fe<0.2, optionally plated with another aluminum alloy with the thickness of the plating being no more than 12% of the total thickness of the sheet, the sheet having a recrystallization rate >50% at all points and a deviation in recrystallization rate between surface and mid-thickness <35%, the sheet having in the quenched and stretched state or in the quenched, stretched and annealed state, a deflection after machining to mid-thickness of a bar resting on two distant supports with a length l such that: EQU fe<0.14l.sup.2, where f is the deflection expressed in micrometers, e being the thickness of the sheet in mm and l is the length of the bar in mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.